|
ENCAPSULATED BRIDGES SINGLE PHASE
|
| |
DEVICE TYPE |
IO(AV) A |
@TC ° C |
VRRM max. V |
| 1 KAB |
1.2 |
45 |
1000 |
| 2 KBB |
1.9 |
45 |
1000 |
| BC 2.2/3.5 |
3.5 |
40 |
1000 |
| 5 SB |
5.0 |
40 |
1000 |
| 26 MB |
25.0 |
65 |
1400 |
| 36 MB |
35.0 |
55 |
1400 |
| 51MB |
50.0 |
65 |
1400 |
| 101 PB |
10.0 |
55 |
1200 |
|
| |
|
ENCAPSULATED BRIDGES THREE PHASE
|
DEVICE TYPE |
IO(AV) A |
@TC °C |
VRRM max. V |
| 6 MT |
6 |
55 |
2800 |
| 16 MT |
16 |
55 |
1200 |
| 26 MT |
25 |
70 |
1200 |
| 36 MT |
35 |
60 |
1200 |
|
| |
|
WELDING STACK
|
| DEVICE TYPE |
|
|
|
|
| S400T25PO4N |
400 |
400 |
40 |
10 |
|
| |
|
WATER COOLED ASSEMBLY
|
| DEVICE TYPE |
Volt |
|
|
|
| 400 A PUK |
1600 |
|
|
|
| 600 E PUK |
1600 |
|
|
|
| 700 E PUK |
1600 |
|
|
|
| 1000 B PUK |
1600 |
|
|
|
|